Parker Lord CoolTherm® 6035 is a two component, thermally conductive, epoxy encapsulant used as a thin bondline adhesive and as a low viscosity potting and casting material. Low viscosity, low exotherm, high thermal conductivity, electrically insulative and UL 94 V-0 certified. Resin Part A, Black, 1 gal Pail.
Typical Use: | Used for attaching semiconductors to heat sinks, or for applications where thermal conductivity and non-burning properties are required. |
Brand: | CoolTherm |
Chemical Composition: | Epoxy resin |
Color: | Black |
Components: | 2 part |
Cure System: | Room Temperature/Heat |
Cure Time: | 24h @ Room Temperature; 2h @ 65 °C |
Dielectric Strength: | 475 V/mil |
Elongation: | 5% |
Flash Point: | ≥93 °C |
Hardness: | 75 D |
Specific Gravity: | Part A: 1.6; Mixed: 1.57 |
Tensile Strength: | 5000 psi |
Thermal Conductivity: | 1 W/mK |
Viscosity: | Part A: 9,500; Mixed: 12,000 |
Volume Resistivity: | 1 x 10^16 ohm-cm |