Bergquist Gap Filler 2000 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for coupling hot electronic components. It cures at room or elevated temperatures and offers mechanical and chemical stability. 1200 cc Kit.
Typical Use: | Designed as a form-in-place elastomer for coupling hot electronic components. |
Brand: | Gap Filler |
Color: | Part A: Pink; Part B: White |
Components: | 2 part |
Cure System: | room temperature/heat |
Dielectric Strength: | 500 V/ml |
Hardness: | 70 OO |
Mix Ratio: | 1:1 |
Thermal Conductivity: | 2.0 W/mK |
Viscosity: | Mixed: 300,000 |
Volume Resistivity: | 10^11 ohm-meter |