Bergquist Gap Filler 1500 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for fragile electronic assemblies and filling difficult air voids and gaps. It offers excellent shear thinning characteristics, slump resistance, mechanical and chemical stability. Gap Filler 1500 is not designed to be a structural adhesive. 1200 cc Kit.
Typical Use: | Designed as a form-in-place elastomer for fragile electronic assemblies and filling difficult air voids and gaps. |
Brand: | Gap Filler |
Color: | Part A: Yellow; Part B: White |
Components: | 2 part |
Cure System: | room temperature/heat |
Cure Time: | 5h @ 25 °C and 10min @ 100 °C |
Dielectric Strength: | 400 V/mil |
Hardness: | 50 OO |
Mix Ratio: | 1:1 |
Thermal Conductivity: | 1.8 W/mK |
Viscosity: | 25 |
Volume Resistivity: | 10^10 ohm-meter |
Working Time: | 60min @ 25 °C |