HumiSeal® 2C51 Silicone High Strength Encapsulating Gel is a two component, fast-curing silicone encapsulating gel for printed circuit board applications. It is also used as a conformal coating for electronics. A room temperature cure, low viscosity and UV tracer allows for ease of application and inspection. 1:1 mix ratio. Part B, 1 L Can.
Typical Use: | Used for general printed circuit board applications. |
Chemical Composition: | Silicone |
Color: | Black |
Components: | 2 part |
Cure System: | Room Temperature/Heat |
Cure Time: | 30 minutes @ 70°C; 60 min @ room temperature |
Flash Point: | >100 °C |
Hardness: | 45 to 55 OO |
Mix Ratio: | 1:1 |
Specific Gravity: | 0.97 |
Viscosity: | 500 |
Volume Resistivity: | 5.2 x 10^13 ohm-cm |