Henkel Loctite Ablestik 285 Black, formerly Emerson and Cuming ECCOBOND, is a thixotropic, epoxy adhesive paste that is designed to be used with a catalyst for applications exposed to cryogenic temperatures as well as bonding ceramics, metal, and heat sinks. It offers a low coefficient of thermal expansion, non-sagging, versatility, low stress bonds, and excellent thermal cycling properties. 22 kg Pail.
Typical Use: | Used for bonding metals and ceramic substrates in heat sink applications or any application that requires a thermally conductive adhesive. |
Brand: | Ablestik |
Chemical Composition: | Epoxy |
Color: | Black |
Components: | 2 part |
Cure Time: | Catalyst 9: 16 to 24h @ 25 °C; Catalyst 11: 8 to 16h @ 80 °C; Catalyst 23LV: 24h @ 25 °C |
Dielectric Strength: | 17.7 kV/mm |
Flash Point: | >93.3 °C |
Mix Ratio: | Catalyst 9: 100:3.5 by volume; Catalyst 9: 100:8.5 by weight; Catalyst 11: 100:4 by volume; Catalyst 11: 100:9.9 by weight; Catalyst 23LV: 100:7.3 by volume; Catalyst 23LV: 100:17 by weight |
Service Temperature: | Catalyst 9: -40 to 130 °C; Catalyst 11: -55 to 155 °C; 23LV: -65 to 105 °C |
Shear Strength: | Catalyst 11: 2,100 to 2,100 @ 25 °C |
Specific Gravity: | 2.4 |
Thermal Conductivity: | Catalyst 9: 1.44 W/mK; Catalyst 11: 1.44 W/mK; 23LV: 1.22 W/mK |
Viscosity: | Catalyst 9: 80 to 105 @ room temperature; Catalyst 11: 35 to 60 @ 65 °C; Catalyst 23LW: 20 to 30 @ room temperature |
Volume Resistivity: | 1 x 10^15 ohm-cm |
Working Time: | Catalyst 9: 45min; Catalyst 11: 4h; Catalyst 23LV: 1h |