Dow DOWSIL™ 1-4173 TC Thermally Conductive Adhesive Gray is a one component, solvent free adhesive that is used for bonding electronic components, housings, lids, base plates, and dispensing equipment. It is heat curing, self-leveling, flowable, good thermal conductivity, and has high tensile strength. 30 mL Syringe.
This is a Dow product repackaged by KitPackers, an authorized repackager of Dow.
Typical Use: | Bonding integrated circuit substrates; adhering lids and housings; attaching base plates and heat sinks. |
Brand: | DOWSIL |
Color: | Gray |
Components: | 1 part |
Cure System: | Heat |
Cure Time: | 90min @ 100 °C; 30min @ 125 °C; 20min @ 150 °C |
Flash Point: | >100 °C |
Hardness: | 92 A |
Service Temperature: | -45 to 200 °C |
Shear Strength: | 650 |
Specific Gravity: | 2.7 |
Viscosity: | 61,000 |