Dow DOWSIL™ 3-6752 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used to cool electronic applications and bond with metals, ceramics, filled plastics, epoxy laminates, and organic substrates. It is flame resistant, self leveling, flowable, thixotropic, and contains no added solvents. 10 kg Pail.
Typical Use: | Used for bonding hybrid circuit substrates, power semiconductor components and devices to heat sinks as well as for use in other bonding applications where flexibility and thermal conductivity are needed. |
Brand: | DOWSIL |
Color: | Gray |
Components: | 1 part |
Cure Time: | 40min @ 100 °C; 10min @ 125 °C; 3min @ 150 °C |
Dielectric Strength: | 400 V/mil |
Elongation: | 15% |
Flash Point: | >100 °C |
Hardness: | 87 A |
Service Temperature: | -45 to 200 °C |
Shear Strength: | 540 |
Specific Gravity: | 2.6 @ 25 °C |
Tensile Strength: | 545 psi |
Thermal Conductivity: | 1.8 W/mK |
Viscosity: | 81,000 |