Dow DOWSIL™ 1-4173 Thermally Conductive Adhesive Gray is a one component, heat curing silicone that is used for bonding heat sinks, housings, base plates, lids, and circuit applications. It provides flowability, chemical stability, and resistance to shock, ozone, stress, and environmental contaminants. 10 kg Pail.
Typical Use: | Bonding integrated circuit substrates; adhering lids and housings; attaching base plates and heat sinks. |
Brand: | DOWSIL |
Color: | Gray |
Components: | 1 part |
Cure Time: | 90min @ 100 °C; 30min @ 125 °C; 20min @ 150 °C |
Dielectric Strength: | 16.7 kV/mm |
Elongation: | 20% |
Flash Point: | >100 °C |
Hardness: | 92 A |
Shear Strength: | 640 |
Specific Gravity: | 2.7 @ 25 °C |
Tensile Strength: | 900 psi |
Thermal Conductivity: | 1.9 W/mK |
Viscosity: | 50,000 |
Volume Resistivity: | 2.2e + 14 ohm-cm |