Dow SYLGARD™ 567 Primerless Silicone Encapsulant Part B Black 20.4 kg Pail

Part number: 567 PR/LESS PT B 20.4KG Manufacturer SKU: 2768895
Dow SYLGARD™ 567 Primerless Silicone Encapsulant Part B Black 20.4 kg Pail
Quantity Price
1 $1,516.79 1516.790000000 USD New Limited Availability 567 PR/LESS PT B 20.4KG
2 $1,385.35 1385.350000000 USD New Limited Availability 567 PR/LESS PT B 20.4KG
3+ $1,355.00 1355.000000000 USD New Limited Availability 567 PR/LESS PT B 20.4KG
Usually Ships in 7-8 Business Weeks. Non-returnable product. Canceled orders may incur a fee at the supplier's discretion.
  • A Made in the USA

Dow SYLGARD™ 567 Primerless Silicone Encapsulant Black is a two component, heat curing elastomer that is used as a protective coating, encapsulating, and potting electrical applications such as LED lighting, power supplies, transformers, sensors, amplifiers, and connectors. It provides flowability, self priming, low viscosity, flame resistance, and good dielectric properties. Part B, 20.4 kg Pail.

<p>Dow SYLGARD™ 567 Primerless Silicone Encapsulant Black is a two component, heat curing elastomer that is used as a protective coating, encapsulating, and potting electrical applications such as LED lighting, power supplies, transformers, sensors, amplifiers, and connectors. It provides flowability, self priming, low viscosity, flame resistance, and good dielectric properties. Part B, 20.4 kg Pail.</p>
Typical Use: Low cost primerless adhesion; encapsulation, protection of electrical/electronic devices.
Brand: SYLGARD
Color: Black
Components: 2 part
Cure System: Heat
Cure Time: 15min @ 150 °C; 60min @ 125 °C; 120min @ 100 °C
Dielectric Strength: 21 kV/mm
Flash Point: 115.5 °C
Hardness: 42 A
Key Specifications: MIL-PRF-23586F (Grade B2), Type I, Class IV, QPL, UL 94 V-0 If you require manufacturer certification to a certain spec, please request a quote as additional fees may apply. Ellsworth Adhesives is an ISO-9001 registered and AS9120 compliant distribut
Mix Ratio: 1:1
Shear Strength: 140
Specific Gravity: 1.24
Thermal Conductivity: 0.3 W/mK
Viscosity: 1,540
Volume Resistivity: 2.1 x 10^15 ohm-cm
Working Time: >3d @ room temperature

 

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