Print
Email
Part number: EP965SC7 CLEAR - A PL
Manufacturer SKU: EP965SC7 CLEAR A PL
Please contact your Ellsworth Customer Service Representative to confirm availability and delivery time.
ResinLab EP965SC7 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part A, 5 gal Pail.
| Typical Use: | Designed for medium sized castings. |
| Chemical Composition: | Epoxy |
| Color: | Clear |
| Components: | 2 part |
| Cure System: | Room Temperature/Heat |
| Cure Time: | 24h @ room temperature; 1h @ 65 °C; 20min @ 110 °C |
| Dielectric Strength: | 410 V/mil |
| Elongation: | 3% to 6% @ break |
| Flash Point: | 249 °C |
| Hardness: | 80 D |
| Mix Ratio: | 1:1 by volume; 100:85 by weight |
| Service Temperature: | -40 to 150 °C |
| Specific Gravity: | Part A: 1.16; Mixed: 1.07 |
| Tensile Strength: | 7,500 psi |
| Thermal Conductivity: | 0.14 W/mK |
| Viscosity: | Part A: 16,000; Mixed: 8,000 |
| Volume Resistivity: | 8 x 10^14 ohm-cm |
| Working Time: | 45 to 60min |
-
Part #: EP965SC7 CLEAR - B PL