ResinLab EP965SC7 Epoxy Encapsulant Part A Black 5 gal Pail

Part number: EP965SC7 BLACK - A PL Manufacturer SKU: EP965SC7 BLACK A PL
ResinLab EP965SC7 Epoxy Encapsulant Part A Black 5 gal Pail
Quantity Price
1 $711.47 711.470000000 USD New Limited Availability EP965SC7 BLACK - A PL
2 $660.65 660.650000000 USD New Limited Availability EP965SC7 BLACK - A PL
3+ $619.07 619.070000000 USD New Limited Availability EP965SC7 BLACK - A PL
Usually Ships in 2-3 Business Days. Non-returnable product. Canceled orders may incur a fee at the supplier's discretion.
  • A Made in the USA

ResinLab EP965SC7 Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part A, 5 gal Pail.

ResinLab EP965SC7 Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part A, 5 gal Pail.
Typical Use: Designed for medium sized castings.
Chemical Composition: Epoxy
Color: Black
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: 24h @ room temperature; 1h @ 65 °C; 20min @ 110 °C
Dielectric Strength: 410 V/mil
Elongation: 3% to 6% @ break
Flash Point: 249 °C
Hardness: 80 D
Mix Ratio: 1:1 by volume; 100:85 by weight
Service Temperature: -40 to 150 °C
Specific Gravity: Part A: 1.16; Mixed: 1.07
Tensile Strength: 7,500 psi
Thermal Conductivity: 0.14 W/mK
Viscosity: Part A: 16,000; Mixed: 8,000
Volume Resistivity: 8 x 10^14 ohm-cm
Working Time: 45 to 60min

 

This site uses cookies

We use cookies to provide you with the best possible experience. By using this site, you accept our terms of service and use of cookies.