ResinLab EP965LVLX Epoxy Encapsulant Part B Black 5 gal Pail

Part number: EP965LVLX BLACK - B PL Manufacturer SKU: EP965LVLX BLACK B PL
ResinLab EP965LVLX Epoxy Encapsulant Part B Black 5 gal Pail

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ResinLab EP965LVLX Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for small to medium casting, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part B, 5 gal Pail.

ResinLab EP965LVLX Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for small to medium casting, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part B, 5 gal Pail.
Typical Use: Designed for small to medium sized castings.
Chemical Composition: Epoxy
Color: Black
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: 24h @ room temperature; 1h @ 65 °C; 20min @ 110 °C
Dielectric Strength: 410 V/mil
Elongation: 10% @ break
Flash Point: >93 °C
Hardness: 80 D
Mix Ratio: 0.96:1 by volume; 1.13:1 by weight
Service Temperature: -40 to 121 °C
Shear Strength: 1,900
Specific Gravity: Part B: 1.01; Mixed: 1.08
Tensile Strength: 4,000 psi
Thermal Conductivity: 0.13 W/mK
Viscosity: Part B: 2,800; Mixed: 2,800
Volume Resistivity: 2.40 x 10^14 ohm-cm

 

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