Print
Email
Part number: EP965LVLX BLACK - B GL
Manufacturer SKU: EP965LVLX BLACK B GL
ResinLab EP965LVLX Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for small to medium casting, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part B, 1 gal Pail.
| Typical Use: | Designed for small to medium sized castings. |
| Chemical Composition: | Epoxy |
| Color: | Black |
| Components: | 2 part |
| Cure System: | Room Temperature/Heat |
| Cure Time: | 24h @ room temperature; 1h @ 65 °C; 20min @ 110 °C |
| Dielectric Strength: | 410 V/mil |
| Elongation: | 10% @ break |
| Flash Point: | >93 °C |
| Hardness: | 80 D |
| Mix Ratio: | 0.96:1 by volume; 1.13:1 by weight |
| Service Temperature: | -40 to 121 °C |
| Shear Strength: | 1,900 |
| Specific Gravity: | Part B: 1.01; Mixed: 1.08 |
| Tensile Strength: | 4,000 psi |
| Thermal Conductivity: | 0.13 W/mK |
| Viscosity: | Part B: 2,800; Mixed: 2,800 |
| Volume Resistivity: | 2.40 x 10^14 ohm-cm |
-
$1,129.16 ($282.29 each)Sold as a case (4/case).Display Quantity PricingPart #: EP965LVLX BLACK - A GL