ResinLab EP9651 Nonylphenol-Free Epoxy Encapsulant Part A Black 1 gal Pail

Part number: EP9651 BLACK A GL
ResinLab EP9651 Nonylphenol-Free Epoxy Encapsulant Part A Black 1 gal Pail

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ResinLab EP9651 Black is a nonylphenol-free version of Resinlab EP965. It is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part A, 1 gal Pail.

<p>ResinLab EP9651 Black is a nonylphenol-free version of Resinlab EP965. It is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents.&nbsp;Part A, 1 gal Pail.</p>
Typical Use: Designed for medium sized castings.
Chemical Composition: Epoxy
Color: Black
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: 24h @ room temperature; 1h @ 65 °C; 20min @ 100 °C
Elongation: 5%
Flash Point: 252 °C
Hardness: 80 D
Mix Ratio: 1:1 by volume; 1.16:1 by weight
Shear Strength: 900 psi
Specific Gravity: Part A: 1.17; Mixed: 1.09
Tensile Strength: 9,000 psi
Viscosity: Part A: 17,000; Mixed: 15,000
Working Time: 10min

 

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