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Part number: EP965 CLEAR - B GL
Manufacturer SKU: EP965 CLEAR B GL
ResinLab EP965 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part B, 1 gal Pail.
| Typical Use: | Designed for small to medium sized castings. |
| Chemical Composition: | Epoxy |
| Color: | Clear |
| Components: | 2 part |
| Cure System: | Room Temperature/Heat |
| Cure Time: | 24h @ 25 °C; 1h @ 65 °C; 20min @ 100 °C; 15min @ 110 °C |
| Dielectric Strength: | 410 V/mil |
| Elongation: | 5% |
| Flash Point: | >100 °C |
| Hardness: | 80 D |
| Mix Ratio: | 1:1 by volume; 1.17:1 by weight |
| Service Temperature: | -40 to 150 °C |
| Shear Strength: | 1,200 |
| Specific Gravity: | Part A: 1.16; Part B: 0.98; Mixed: 1.07 |
| Tensile Strength: | 8,500 psi |
| Thermal Conductivity: | >0.2 W/mK |
| Viscosity: | Part A: 14,000; Part B: 8,000; Mixed: 11,000 |
| Volume Resistivity: | 6.19 x 10^15 ohm-cm |
| Working Time: | 12min |
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