Quantity | Price |
---|---|
1-4 | $46.73 |
5-37 | $26.44 |
38+ | $23.13 |
ResinLab EP965 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. 50 mL Cartridge.
Typical Use: | Designed for small to medium sized castings. |
Chemical Composition: | Epoxy |
Color: | Clear |
Components: | 2 part |
Cure System: | Room Temperature/Heat |
Cure Time: | 24h @ 25 °C; 1h @ 65 °C; 20min @ 100 °C; 15min @ 110 °C |
Dielectric Strength: | 410 V/mil |
Elongation: | 5% |
Flash Point: | Part A: 252 °C; Part B: >100 °C |
Hardness: | 80 D |
Mix Ratio: | 1:1 by volume; 1.17:1 by weight |
Service Temperature: | -40 to 150 °C |
Shear Strength: | 1,200 |
Specific Gravity: | Part A: 1.16; Part B: 0.98; Mixed: 1.07 |
Tensile Strength: | 8,500 psi |
Thermal Conductivity: | >0.2 W/mK |
Viscosity: | Part A: 14,000; Part B: 8,000; Mixed: 11,000 |
Volume Resistivity: | 6.19 x 10^15 ohm-cm |
Working Time: | 12min |