Print
Email
Part number: EP691F CLEAR - B PL
Manufacturer SKU: EP691F CLEAR B PL
For current pricing and to place an order please contact your Ellsworth Customer Service Representative.
ResinLab EP691F Clear is a two component, room temperature or heat curing, epoxy encapsulant that is used for medium to large castings and filling voids. It is electronic grade, rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part B, 5 gal Pail.
| Typical Use: | Designed for medium to large castings. |
| Chemical Composition: | Epoxy |
| Color: | Clear |
| Components: | 2 part |
| Cure System: | Room Temperature/Heat |
| Cure Time: | 24 to 48h @ room temperature; 2h @ 65 °C; 1h @ 100 °C |
| Dielectric Strength: | 550 V/mil |
| Elongation: | 4.5% |
| Flash Point: | 128 °C |
| Hardness: | 80 D |
| Mix Ratio: | 3.13:1 by weight; 2.55:1 by volume |
| Service Temperature: | -40 to 150 °C |
| Shear Strength: | 2,000 |
| Specific Gravity: | Part B: 0.95; Mixed: 1.10 |
| Tensile Strength: | 8,300 psi |
| Viscosity: | Part B: 10; Mixed: 700 |
| Volume Resistivity: | 3.16 x 10^16 ohm-cm |
| Working Time: | 2h |
-
Part #: EP691F CLEAR - A PL