ResinLab EP691 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part A, 1 gal Pail.
Typical Use: | Designed for medium sized castings requiring good clarity. |
Chemical Composition: | Epoxy |
Color: | Clear |
Components: | 2 part |
Cure System: | Room Temperature/Heat |
Cure Time: | 24h @ room temperature; 1h @ 65 °C; 20min @ 100 °C |
Dielectric Strength: | 410 V/mil |
Elongation: | 1% to 2% @ break |
Flash Point: | 252 °C |
Hardness: | 80 D |
Mix Ratio: | 2:1 by volume; 100:45 by weight |
Service Temperature: | -40 to 121 °C |
Specific Gravity: | Part A: 1.16; Mixed: 1.11 |
Tensile Strength: | 8,500 psi |
Thermal Conductivity: | 0.14 W/mK |
Viscosity: | Part A: 16,000; Mixed: 9,000 |
Volume Resistivity: | 8 x 10^14 ohm-cm |
Working Time: | >2h |