ResinLab EP1300 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for small to medium castings. It is electronic grade, free flowing, and has good wetting and air release. It is resistant to bases, acids, water, and most organic solvents. Part B, 5 gal Pail.
Typical Use: | Electronic grade epoxy encapsulant for small to medium sized castings. |
Chemical Composition: | Epoxy |
Color: | Clear |
Components: | 2 part |
Cure System: | Room Temperature/Heat |
Cure Time: | 30min @ 100 °C; 1h @ 80 °C; 4h @ 50 °C |
Dielectric Strength: | 850 V/mil |
Elongation: | 10% |
Flash Point: | >101 °C |
Hardness: | 80 D |
Mix Ratio: | 1:1 by volume; 1.15:1 by weight |
Service Temperature: | -40 to 150 °C |
Shear Strength: | 1,100 |
Specific Gravity: | Part B: 0.96; Mixed: 1.05 |
Tack Free Time: | 3 to 4h |
Tensile Strength: | 4,500 psi |
Thermal Conductivity: | <0.2 W/mK |
Viscosity: | Part B: 7,000; Mixed: 7,300 |
Volume Resistivity: | 6.8 x 10^15 ohm-cm |