ResinLab EP1300 Epoxy Encapsulant Part B Clear 5 gal Pail

Part number: EP1300 CLEAR B PL
ResinLab EP1300 Epoxy Encapsulant Part B Clear 5 gal Pail

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ResinLab EP1300 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for small to medium castings. It is electronic grade, free flowing, and has good wetting and air release. It is resistant to bases, acids, water, and most organic solvents. Part B, 5 gal Pail.

<p>ResinLab EP1300 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for small to medium castings. It is electronic grade, free flowing, and has good wetting and air release. It is resistant to bases, acids, water, and most organic solvents. Part B, 5 gal Pail.</p>
Typical Use: Electronic grade epoxy encapsulant for small to medium sized castings.
Chemical Composition: Epoxy
Color: Clear
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: 30min @ 100 °C; 1h @ 80 °C; 4h @ 50 °C
Dielectric Strength: 850 V/mil
Elongation: 10%
Flash Point: >101 °C
Hardness: 80 D
Mix Ratio: 1:1 by volume; 1.15:1 by weight
Service Temperature: -40 to 150 °C
Shear Strength: 1,100
Specific Gravity: Part B: 0.96; Mixed: 1.05
Tack Free Time: 3 to 4h
Tensile Strength: 4,500 psi
Thermal Conductivity: &lt;0.2 W/mK
Viscosity: Part B: 7,000; Mixed: 7,300
Volume Resistivity: 6.8 x 10^15 ohm-cm

 

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