ResinLab EP1282 Epoxy Encapsulant Part B Clear 5 gal Pail

Part number: EP1282 CLEAR - B PL Manufacturer SKU: EP1282 CLEAR B PL
ResinLab EP1282 Epoxy Encapsulant Part B Clear 5 gal Pail
Quantity Price
1 $1,158.46 1158.460000000 USD New Limited Availability EP1282 CLEAR - B PL
2 $1,075.71 1075.710000000 USD New Limited Availability EP1282 CLEAR - B PL
3+ $1,008.01 1008.010000000 USD New Limited Availability EP1282 CLEAR - B PL
  • Item usually ships in 10-14 business days
  • Item is noncancelable and nonreturnable

ResinLab EP1282 Clear is a two component, room temperature or heat curing, unfilled, flame resistant, epoxy encapsulant that is used for medium castings. It offers good wetting, semi-rigid polymer, high gloss surface, good thermal shock and cycling properties. It is resistant to bases, acids, water, and most organic solvents. Part B, 5 gal Pail.

ResinLab EP1282 Clear is a two component, room temperature or heat curing, unfilled, flame resistant, epoxy encapsulant that is used for medium castings. It offers good wetting, semi-rigid polymer, high gloss surface, good thermal shock and cycling properties. It is resistant to bases, acids, water, and most organic solvents. Part B, 5 gal Pail.
Typical Use: Designed for medium sized castings.
Chemical Composition: Epoxy
Color: Clear
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: 24 to 48h @ 25 °C; 1h @ 65 °C; 20min @ 100 °C
Dielectric Strength: 778 V/mil
Elongation: 56%
Flash Point: >93 °C
Hardness: 70 D
Mix Ratio: 1:1 by volume; 1.17:1 by weight
Service Temperature: -40 to 150 °C
Shear Strength: 1,500
Specific Gravity: Part A: 1.14; Part B: 0.98; Mixed: 1.06
Tensile Strength: 2,400 psi
Thermal Conductivity: 0.2 W/mK
Viscosity: Part A: 6,000; Part B: 2,000; Mixed: 3,000
Volume Resistivity: 1.32 x 10^14 ohm-cm
Working Time: 1h

 

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