ResinLab EP1282 Clear is a two component, room temperature or heat curing, unfilled, flame resistant, epoxy encapsulant that is used for medium castings. It offers good wetting, semi-rigid polymer, high gloss surface, good thermal shock and cycling properties. It is resistant to bases, acids, water, and most organic solvents. Part A, 5 gal Pail.
Typical Use: | Designed for medium sized castings. |
Chemical Composition: | Epoxy |
Color: | Clear |
Components: | 2 part |
Cure System: | Room Temperature/Heat |
Cure Time: | 24 to 48h @ room temperature; 1h @ 65 °C; 20min @ 100 °C |
Dielectric Strength: | 500 V/mil |
Elongation: | 120% @ 10,000 psi |
Flash Point: | >252 °C |
Hardness: | 70 D |
Mix Ratio: | 1:1 by volume; 1.17:1 by weight |
Service Temperature: | -40 to 150 °C |
Specific Gravity: | Part A: 1.14; Mixed: 1.06 |
Tensile Strength: | 1,600 psi |
Thermal Conductivity: | 0.11 W/mK |
Viscosity: | Part A: 6,000; Mixed: 3,000 |
Volume Resistivity: | 7.44 x 10^11 ohm-cm |
Working Time: | 1h |