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Part number: EP1121 CLEAR B GL
ResinLab EP1121 Clear is a two component, room temperature curing, unfilled epoxy encapsulant that is used for medium to large castings and penetrating circuitry. It has flexibility, low viscosity, good wicking, good air release, excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. Part B, 1 gal Pail.
| Typical Use: | Designed for small to medium sized castings. |
| Chemical Composition: | Epoxy |
| Color: | Clear |
| Components: | 2 part |
| Cure System: | Room Temperature/Heat |
| Cure Time: | 24 to 48h @ 25 °C; 2h @ 65 °C; 30min @ 100 °C |
| Dielectric Strength: | 410 V/mil |
| Elongation: | 80% |
| Flash Point: | >93 °C |
| Hardness: | 65 D |
| Mix Ratio: | 1.05:1 by volume; 1.20:1 by weight |
| Service Temperature: | -40 to 150 °C |
| Shear Strength: | 1,200 |
| Specific Gravity: | Part A: 1.11; Part B: 0.96; Mixed: 1.04 |
| Tensile Strength: | 1,500 psi |
| Thermal Conductivity: | 0.1 W/mK |
| Viscosity: | Part A: 2,500; Part B: 4,200; Mixed: 3,800 |
| Volume Resistivity: | 8 x 10^14 ohm-cm |
| Working Time: | 20min |
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