ResinLab EP1121 Epoxy Encapsulant Clear 600 mL Cartridge

Part number: EP1121 CLEAR 600ML
ResinLab EP1121 Epoxy Encapsulant Clear 600 mL Cartridge
Quantity Price
1 $1,313.16 ($109.43 each) 1313.160000000 USD New Limited Availability EP1121 CLEAR 600ML
2 $1,011.12 ($84.26 each) 1011.120000000 USD New Limited Availability EP1121 CLEAR 600ML
3+ $938.88 ($78.24 each) 938.880000000 USD New Limited Availability EP1121 CLEAR 600ML
Sold as a pack (12/pk).
Item usually ships in 15-20 business days.
  • J Haz Class 8

ResinLab EP1121 Clear is a two component, room temperature curing, unfilled epoxy encapsulant that is used for medium to large castings and penetrating circuitry. It has flexibility, low viscosity, good wicking, good air release, excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. 600 mL Cartridge.

<p>ResinLab EP1121 Clear is a two component, room temperature curing, unfilled epoxy encapsulant that is used for medium to large castings and penetrating circuitry. It has flexibility, low viscosity, good wicking, good air release, excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. 600 mL Cartridge.</p>
Typical Use: Designed for small to medium sized castings.
Chemical Composition: Epoxy
Color: Clear
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: 24 to 48h @ 25 °C; 2h @ 65 °C; 30min @ 100 °C
Dielectric Strength: 410 V/mil
Elongation: 80%
Flash Point: >93 °C
Hardness: 65 D
Mix Ratio: 1.05:1 by volume; 1.20:1 by weight
Service Temperature: -40 to 150 °C
Shear Strength: 1,200
Specific Gravity: Part A: 1.11; Part B: 0.96; Mixed: 1.04
Tensile Strength: 1,500 psi
Thermal Conductivity: 0.1 W/mK
Viscosity: Part A: 2,500; Part B: 4,200; Mixed: 3,800
Volume Resistivity: 8 x 10^14 ohm-cm
Working Time: 20min

 

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