ResinLab EP1112NC Epoxy Encapsulant Part B Black 1 gal Pail

Part number: EP1112NC BLACK - B GL Manufacturer SKU: EP1112NC BLACK B GL
ResinLab EP1112NC Epoxy Encapsulant Part B Black 1 gal Pail
Quantity Price
1 $1,271.56 ($317.89 each) 1271.560000000 USD New Limited Availability EP1112NC BLACK - B GL
2 $979.08 ($244.77 each) 979.080000000 USD New Limited Availability EP1112NC BLACK - B GL
3+ $909.16 ($227.29 each) 909.160000000 USD New Limited Availability EP1112NC BLACK - B GL
Sold as a pack (4/pk).
Usually Ships in 2-3 Business Days. Non-returnable product. Canceled orders may incur a fee at the supplier's discretion.

ResinLab EP1112NC Black is a two component, room temperature curing, unfilled epoxy encapsulant that is used for small to medium sized castings and penetrating circuitry. It is electronic grade, low viscosity, flexible, good wicking, gives good air release, and has excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. Part B, 1 gal Pail.

ResinLab EP1112NC Black is a two component, room temperature curing, unfilled epoxy encapsulant that is used for small to medium sized castings and penetrating circuitry. It is electronic grade, low viscosity, flexible, good wicking, gives good air release, and has excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. Part B, 1 gal Pail.
Typical Use: Its low viscosity allows for good wicking and penetration into components and circuitry and also gives good air release.
Chemical Composition: Epoxy
Color: Black
Components: 2 part
Cure System: Room Temperature
Cure Time: 6 to 12h @ room temperature; 1h @ 65 °C; 10min @ 100 °C
Dielectric Strength: 410 V/mil
Elongation: 40% @ break
Flash Point: >93 °C
Hardness: 70 D
Mix Ratio: 1:1 by volume; 1.20:1 by weight
Service Temperature: -40 to 121 °C
Specific Gravity: Part B: 0.98; Mixed: 1.06
Tensile Strength: 3,000 psi
Thermal Conductivity: 0.14 W/mK
Viscosity: Part B: 800; Mixed: 1,050
Volume Resistivity: 4.52 x 10^14 ohm-cm

 

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