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Part number: EP1112NC BLACK - B GL
Manufacturer SKU: EP1112NC BLACK B GL
ResinLab EP1112NC Black is a two component, room temperature curing, unfilled epoxy encapsulant that is used for small to medium sized castings and penetrating circuitry. It is electronic grade, low viscosity, flexible, good wicking, gives good air release, and has excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. Part B, 1 gal Pail.
| Typical Use: | Its low viscosity allows for good wicking and penetration into components and circuitry and also gives good air release. |
| Chemical Composition: | Epoxy |
| Color: | Black |
| Components: | 2 part |
| Cure System: | Room Temperature |
| Cure Time: | 6 to 12h @ room temperature; 1h @ 65 °C; 10min @ 100 °C |
| Dielectric Strength: | 410 V/mil |
| Elongation: | 40% @ break |
| Flash Point: | >93 °C |
| Hardness: | 70 D |
| Mix Ratio: | 1:1 by volume; 1.20:1 by weight |
| Service Temperature: | -40 to 121 °C |
| Specific Gravity: | Part B: 0.98; Mixed: 1.06 |
| Tensile Strength: | 3,000 psi |
| Thermal Conductivity: | 0.14 W/mK |
| Viscosity: | Part B: 800; Mixed: 1,050 |
| Volume Resistivity: | 4.52 x 10^14 ohm-cm |
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