ResinLab EP1046FG Clear is a two component, room temperature and heat curing, epoxy encapsulant that is used for small castings. It is electronic grade, semi-rigid, fast curing, low viscosity, and resistant to water and most solvents. 50 mL Cartridge.
Typical Use: | Designed for small castings (less than 25 grams). |
Chemical Composition: | Epoxy/acrylate |
Color: | Clear |
Components: | 2 part |
Cure System: | Room Temperature/Heat |
Cure Time: | 1 to 2h @ room temperature; 30min @ 65 °C; 10min @ 100 °C |
Dielectric Strength: | 410 V/mil |
Elongation: | 7% @ break |
Hardness: | 80 D |
Mix Ratio: | 1:1 by volume; 1.19:1 by weight |
Service Temperature: | -40 to 150 °C |
Specific Gravity: | Mixed: 1.06 |
Tensile Strength: | 4,800 psi |
Thermal Conductivity: | 0.1 W/mK |
Viscosity: | Mixed: 2,000 |
Volume Resistivity: | 4.8 x 10^15 ohm-cm |