ResinLab EP1026 Epoxy Adhesive Part A Clear 1 gal Pail

Part number: EP1026 CLEAR A GL
ResinLab EP1026 Epoxy Adhesive Part A Clear 1 gal Pail
Quantity Price
1 $843.24 ($210.81 each) 843.240000000 USD New Limited Availability EP1026 CLEAR A GL
2 $649.28 ($162.32 each) 649.280000000 USD New Limited Availability EP1026 CLEAR A GL
3+ $602.92 ($150.73 each) 602.920000000 USD New Limited Availability EP1026 CLEAR A GL
Sold as a pack (4/pk).
Usually Ships in 2-3 Business Days. Non-returnable product. Canceled orders may incur a fee at the supplier’s discretion.
  • K Haz Class 9

ResinLab EP1026 Clear is a two component, room and elevated temperature curing, unfilled adhesive that is used for bonding plastics, metal, and ceramics. It is semi-rigid, free flowing, and resistant to salt spray, water, and most organic and inorganic solvents. 1:1 mix ratio. Part A, 1 gal Pail.

<p>ResinLab EP1026 Clear is a two component, room and elevated temperature curing, unfilled adhesive that is used for bonding plastics, metal, and ceramics. It is semi-rigid, free flowing, and resistant to salt spray, water, and most organic and inorganic solvents. 1:1 mix ratio. Part A, 1 gal Pail.</p>
Typical Use: Designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free flowing in viscosity. It gives good resistance to water, salt spray, inorganic acids and bases, and most organic solvents.
Chemical Composition: Epoxy
Color: Clear
Components: 2 part
Cure System: Room Temperature
Cure Time: 24h @ room temperature
Dielectric Strength: 410 V/mil
Elongation: 10% to 20% @ break
Flash Point: 252 °C
Hardness: 85 D
Mix Ratio: 1:1 by volume; 1:1 by weight
Service Temperature: -40 to 90 °C
Shear Strength: 2,500
Specific Gravity: Part A: 1.16; Mixed: 1.14
Tensile Strength: 7,500 psi
Thermal Conductivity: 0.185 W/mK
Viscosity: Part A: 16,000; Mixed: 15,500
Volume Resistivity: 8 x 10^14 ohm-cm
Working Time: 3 to 5min

 

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