Henkel Loctite ECCOBOND E 1216M is an epoxy, fast-flowing capillary underfill encapsulant that is used for high volume assemblies. It fully cures in a single reflow cycle and provides excellent stability, adhesion, and strength. 30 cc Syringe.
Typical Use: | Used as a fast, void-free underfill of area array devices. |
Brand: | ECCOBOND |
Chemical Composition: | Epoxy resin |
Color: | Black |
Components: | 1 part |
Cure System: | Heat |
Cure Time: | 3min @ 165 °C; 4min @ 150 °C; 10min @ 130 °C |
Dielectric Strength: | 42 kV/mm |
Flash Point: | >100 °C |
Hardness: | 86 D |
Specific Gravity: | 1.4 |
Thermal Conductivity: | 0.42 W/mK |
Viscosity: | 4,000 |
Volume Resistivity: | 2.82 x 10^16 ohm-cm |