Henkel Loctite Ablestik 84-1LMI Epoxy Die Attach Adhesive Silver is used for microelectronic chip bonding applications. It offers low bleed, low outgassing, and is electrically conductive. 10 cc Syringe.
Typical Use: | Used for microelectronic chip bonding applications. |
Brand: | Ablestik |
Color: | Silver |
Components: | 1 part |
Cure System: | Heat |
Cure Time: | 1h @ 150 °C |
Flash Point: | >93 °C |
Specific Gravity: | 3.4 to 3.5 |
Thermal Conductivity: | 2.4 W/mK |
Viscosity: | 30,000 |