Henkel Loctite Ablestik 84-1LMI Epoxy Die Attach Adhesive Silver 10 cc Syringe

Part number: 84-1LMI 10CC SYRINGE Manufacturer SKU: 1199235
Henkel Loctite Ablestik 84-1LMI Epoxy Die Attach Adhesive Silver 10 cc Syringe

Due to raw material shortages, this product is unavailable to purchase on the web. Please contact your Ellsworth Customer Service Representative to confirm availability and delivery time.

Call Us

Call Us
Contact customer service at 877-454-9224.

Email Us

Email Us
Email us for product availability.

 

Henkel Loctite Ablestik 84-1LMI Epoxy Die Attach Adhesive Silver is used for microelectronic chip bonding applications. It offers low bleed, low outgassing, and is electrically conductive. 10 cc Syringe.

<p><span>Henkel Loctite Ablestik 84-1LMI Epoxy Die Attach Adhesive Silver is used for microelectronic chip bonding applications. It offers low bleed, low outgassing, and is electrically conductive. 10 cc Syringe.</span></p>
Typical Use: Used for microelectronic chip bonding applications.
Brand: Ablestik
Color: Silver
Components: 1 part
Cure System: Heat
Cure Time: 1h @ 150 °C
Flash Point: >93 °C
Specific Gravity: 3.4 to 3.5
Thermal Conductivity: 2.4 W/mK
Viscosity: 30,000

 

This site uses cookies

We use cookies to provide you with the best possible experience. By using this site, you accept our terms of service and use of cookies.