ELANTAS PDG Epoxylite® E 813-9 HI TEMP Epoxy Potting Compound 100 g Kit

Part number: E 813-9 HI TEMP 100GM KIT Manufacturer SKU: 119840
ELANTAS PDG Epoxylite® E 813-9 HI TEMP Epoxy Potting Compound 100 g Kit
Quantity Price
1 $165.61 165.610000000 USD New Limited Availability E 813-9 HI TEMP 100GM KIT
2-7 $141.81 141.810000000 USD New Limited Availability E 813-9 HI TEMP 100GM KIT
8+ $133.88 133.880000000 USD New Limited Availability E 813-9 HI TEMP 100GM KIT
Usually Ships in 3-4 Business Weeks. Non-returnable product. Canceled orders may incur a fee at the supplier’s discretion.

ELANTAS PDG Epoxylite® E 813-9 HI TEMP Epoxy Potting Compound is a two-component system used for potting and sealing of electrical and electronic components requiring resistance to high temperatures. It has excellent adhesion to metals, ceramics, and most plastics. It is resistant to acids, alkalis and solvents. 100 g Kit.

<p><span>ELANTAS PDG Epoxylite&reg; E 813-9 HI TEMP Epoxy Potting Compound is a two-component system used for potting and sealing of electrical and electronic components requiring resistance to high temperatures. It has excellent adhesion to metals, ceramics, and most plastics. It is resistant to acids, alkalis and solvents. 100 g Kit.</span></p>
Typical Use: Used for potting and sealing of electrical and electronic components requiring resistance to high temperatures.
Brand: Epoxylite
Components: 2 part
Cure System: Heat
Dielectric Strength: >600 V/mil
Flash Point: >94 °C
Hardness: 95 D
Mix Ratio: 100:39 by weight
Thermal Conductivity: 0.3 W/mK

 

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