Ellsworth Adhesives - Home > Products > By Manufacturer > ELANTAS PDG > Encapsulants > Epoxy > ELANTAS PDG Epoxylite® E 813-9 HI TEMP Epoxy Potting Compound 100 g Kit

ELANTAS PDG Epoxylite® E 813-9 HI TEMP Epoxy Potting Compound 100 g Kit

Part number: E 813-9 HI TEMP 100GM KIT Manufacturer SKU: 119840
ELANTAS PDG Epoxylite® E 813-9 HI TEMP Epoxy Potting Compound 100 g Kit
Quantity Price
1 $165.61 165.610000000 USD New Limited Availability E 813-9 HI TEMP 100GM KIT
2-7 $141.81 141.810000000 USD New Limited Availability E 813-9 HI TEMP 100GM KIT
8+ $133.88 133.880000000 USD New Limited Availability E 813-9 HI TEMP 100GM KIT
  • Item usually ships in 21-30 business days
  • Item is noncancelable and nonreturnable

 Description

ELANTAS PDG Epoxylite® E 813-9 HI TEMP Epoxy Potting Compound is a two-component system used for potting and sealing of electrical and electronic components requiring resistance to high temperatures. It has excellent adhesion to metals, ceramics, and most plastics. It is resistant to acids, alkalis and solvents. 100 g Kit.

<p><span>ELANTAS PDG Epoxylite&reg; E 813-9 HI TEMP Epoxy Potting Compound is a two-component system used for potting and sealing of electrical and electronic components requiring resistance to high temperatures. It has excellent adhesion to metals, ceramics, and most plastics. It is resistant to acids, alkalis and solvents. 100 g Kit.</span></p>

Typical Use: Used for potting and sealing of electrical and electronic components requiring resistance to high temperatures.
Brand: Epoxylite
Components: 2 part
Cure System: Heat
Dielectric Strength: >600 V/mil
Flash Point: >94 °C
Hardness: 95 D
Mix Ratio: 100:39 by weight
Thermal Conductivity: 0.3 W/mK

 

This site uses cookies

We use cookies to provide you with the best possible experience. By using this site, you accept our terms of service and use of cookies.