DYMAX 9001-E-V3 Series Encapsulant Clear is a one component, UV light and instant curing urethane that is used for bonding electronic devices, print circuit boards, multi-chip modules, chip-on-flex, and chip-on-board applications. It offers flexibility, good electrical properties, and resistance to thermal cycle and moisture. 10 mL MR Syringe.
Typical Use: | Multi-Cure 9001-E-V3 series encapsulants display excellent adhesion to PC boards and electronic components and are especially well suited for chip on board, chip on flex, and multi-chip modules. |
Brand: | Multi-Cure |
Chemical Composition: | Modified urethane |
Color: | Clear |
Components: | 1 part |
Cure System: | UV/Heat |
Cure Time: | UV Cure: 30s; Heat Cure: 60min @ 110 °C |
Dielectric Strength: | 500 V/mil |
Elongation: | 150% @ break |
Flash Point: | 101 °C |
Hardness: | 45 D |
Tensile Strength: | 750 psi @ break |
Viscosity: | 4,500 |
Volume Resistivity: | 555 x 10^12 ohm-cm |