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Part number: TC-2035 ADHESIVE A/B 3.2KG KIT
Manufacturer SKU: 4113729
Dow DOWSIL™ TC-2035 Thermally Conductive Adhesive is a two component, silicone heat curing adhesive with primerless adhesion and low bond line thickness. It offers outstanding dielectric properties, stable performance at high temperatures, and bonds to a variety of substrates. 3.2 kg Kit.
| Typical Use: | Used for bonding filled plastics, metals, ceramics, epoxy laminate boards, and reactive materials. |
| Brand: | DOWSIL |
| Chemical Composition: | Silicone |
| Color: | Part A: White; Part B: Reddish Brown |
| Components: | 2 part |
| Cure System: | Heat |
| Cure Time: | 30min @ 125 °C; 10min @ 150 °C |
| Dielectric Strength: | 533 V/m |
| Elongation: | 43% |
| Flash Point: | Part A: >100 °C; Part B: >100 °C |
| Hardness: | 95 A |
| Mix Ratio: | 1:1 by volume; 1:1 by weight |
| Tensile Strength: | 522 psi |
| Thermal Conductivity: | 3.3 W/mK |
| Viscosity: | Mixed: 125,000 |
| Volume Resistivity: | 5.5e + 15 ohm-cm |
| Working Time: | 4h @ 25 °C |
