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Part number: TC-5515 LT GAP FILLER 720G KIT
Manufacturer SKU: 99151387
Dow DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler is a two component, silicone material that is used to dissipate heat from electronic devices, EV modules, and other heat-generating components. It is non-flowable and cures at room temperature or heat accelerated. 720 g Kit.
| Typical Use: | Used to provide reliable cooling performance. |
| Brand: | DOWSIL |
| Chemical Composition: | Silicone |
| Color: | Part A: White; Part B: Blue |
| Components: | 2 part |
| Cure System: | Room Temperature |
| Cure Time: | 360 min @ 25 °C; 30 min @ 80 °C |
| Dielectric Strength: | 19 kV/mm |
| Hardness: | 65 OO |
| Key Specifications: | UL 94 V0 |
| Mix Ratio: | 1:1 |
| Service Temperature: | -40 to 150 °C |
| Specific Gravity: | 1.95 |
| Thermal Conductivity: | 1.7 W/mK |
| Viscosity: | Part A: 150; Part B: 120; Mixed: 140 |
| Working Time: | 90 min @ 25 °C |