Quantity | Price |
---|---|
1-5 | $36.34 |
6-35 | $27.99 |
36+ | $25.98 |
ResinLab OXY-BOND™ 109-DP Epoxy Clear is a two component, room temperature curing, resin that is used for laminating, small potting, and industrial applications. It bonds well to plastics, metal, optical fibers, and ceramics. It offers low viscosity, low shrinkage, wide service temperature range, and durability. It has excellent physical, mechanical, and electrical properties. It is resistant to water, gasoline, oxygen, alcohol, weather, salt solutions, inorganic and organic compounds. 50 mL Cartridge.
OXY-BOND™ is a trademark of Henkel and its affiliates in the US and elsewhere, and used under license. Product manufactured under license from Henkel.
Typical Use: | Recommended for electronic/electrical casting and encapsulating applications. Excellent in high voltage applications, such as power supplies, transformers, bushings and insulators. |
Brand: | OXY-BOND |
Chemical Composition: | Resin: Epoxy; Hardener: Polyglycol |
Color: | Clear |
Components: | 2 part |
Cure System: | Room Temperature/Heat |
Cure Time: | 24h @ 25 °C; 0.5h @ 65 °C |
Dielectric Strength: | >400 V/mil |
Flash Point: | Resin: 248.8 °C; Hardener: 139 °C |
Hardness: | 83 D |
Mix Ratio: | 100:50 by volume; 100:45 by weight |
Service Temperature: | -60 to 120 °C |
Shear Strength: | 2,500 @ 25 °C; 500 @ 100 °C |
Specific Gravity: | Mixed: 1.15 |
Tensile Strength: | 7,300 psi |
Viscosity: | Mixed: 2,500 @ 25 °C |
Working Time: | 0.5h |