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Part number: EP750 CLEAR - B GL
Manufacturer SKU: EP750 CLEAR B GL
ResinLab EP750 Clear is a two component, room temperature or heat curing, unfilled, epoxy structural adhesive that is used for bonding with most materials and filling voids. It is semi-rigid, free flowing, and has good wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part B, 1 gal Pail.
| Typical Use: | Designed for bonding application requiring conformance to the Code of Federal Regulations Title 21 175.105 (Adhesives) and 175.300 (Resinous and polymeric coatings). |
| Chemical Composition: | Epoxy |
| Color: | Clear |
| Components: | 2 part |
| Cure System: | Room Temperature |
| Cure Time: | 24 to 72h @ room temperature |
| Dielectric Strength: | 410 V/mil |
| Elongation: | 4% to 10% @ break |
| Flash Point: | >185 °C |
| Hardness: | 65 to 80 D |
| Mix Ratio: | 1:1 |
| Service Temperature: | -40 to 150 °C |
| Shear Strength: | 1,550 to 2,500 |
| Specific Gravity: | Part B: 0.98; Mixed: 1.03 to 1.07 |
| Tensile Strength: | 3,500 to 8,000 psi |
| Viscosity: | Part B: 9,000; Mixed: 14,500 to 15,000 |
| Volume Resistivity: | 8.3 x 10^14 ohm-cm |
| Working Time: | 45 to 60min |
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