ResinLab EP750 Epoxy Adhesive Part A Clear 5 gal Pail

Part number: EP750 CLEAR - A PL Manufacturer SKU: EP750 CLEAR A PL
ResinLab EP750 Epoxy Adhesive Part A Clear 5 gal Pail
Quantity Price
1 $590.38 590.380000000 USD New Limited Availability EP750 CLEAR - A PL
2 $548.21 548.210000000 USD New Limited Availability EP750 CLEAR - A PL
3+ $513.71 513.710000000 USD New Limited Availability EP750 CLEAR - A PL
Usually Ships in 2-3 Business Days. Non-returnable product. Canceled orders may incur a fee at the supplier's discretion.
  • K Haz Class 9

ResinLab EP750 Clear is a two component, room temperature or heat curing, unfilled, epoxy structural adhesive that is used for bonding with most materials and filling voids. It is semi-rigid, free flowing, and has good wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part A, 5 gal Pail.

ResinLab EP750 Clear is a two component, room temperature or heat curing, unfilled, epoxy structural adhesive that is used for bonding with most materials and filling voids. It is semi-rigid, free flowing, and has good wetting properties. It is resistant to bases, acids, water, and most organic solvents. Part A, 5 gal Pail.
Typical Use: Designed for bonding application requiring conformance to the Code of Federal Regulations Title 21 175.105 (Adhesives) and 175.300 (Resinous and polymeric coatings).
Chemical Composition: Epoxy
Color: Clear
Components: 2 part
Cure System: Room Temperature
Cure Time: 24 to 72h @ room temperature
Dielectric Strength: 410 V/mil
Elongation: 4% to 10% @ break
Flash Point: 249 °C
Hardness: 65 to 80 D
Mix Ratio: 1:1
Service Temperature: -40 to 150 °C
Shear Strength: 1,550 to 2,500
Specific Gravity: Part A: 1.16; Mixed: 1.03 to 1.07
Tensile Strength: 3,500 to 8,000 psi
Viscosity: Part A: 16,000; Mixed: 14,500 to 15,000
Volume Resistivity: 8.3 x 10^14 ohm-cm
Working Time: 45 to 60min

 

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