ResinLab EP750 Black is a two component, room temperature or heat curing, unfilled, epoxy structural adhesive that is used for bonding with most materials and filling voids. It is semi-rigid, free flowing, and has good wetting properties. It is resistant to bases, acids, water, and most organic solvents. 400 mL Cartridge.
Typical Use: | This product has good wetting and adhesion to most surfaces. This product has a free flowing viscosity. It has very good resistance to water, acids and bases and most organic solvents. |
Chemical Composition: | Part A: Epoxy resin; Part B: Polyamide blend |
Color: | Black |
Components: | 2 part |
Cure System: | Heat |
Cure Time: | 24 to 72h @ 25 °C; 15m @ 100 °C; 1h @ 65 °C |
Dielectric Strength: | 410 V/mil |
Elongation: | 5% to 7% |
Flash Point: | >93.3 °C |
Hardness: | 65 to 80 D |
Key Specifications: | Code of Federal Regulations Title 21 175.105 (Adhesives) and 175.300 (Resinous and polymeric coatings). |
Mix Ratio: | 1:1 by volume |
Service Temperature: | -40 to 150 °C |
Shear Strength: | 1,550 to 2,500 |
Specific Gravity: | Mixed: 1.03 to 1.07 |
Tensile Strength: | 7,500 psi |
Viscosity: | Mixed: 14,500 to 15,000 |
Volume Resistivity: | 8.3 x 10^14 ohm-cm |
Working Time: | 45 to 60min |