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Part number: EP1325 BLACK GL
For current pricing and to place an order please contact your Ellsworth Customer Service Representative.
ResinLab EP1325 Black is a one component, heat curing, thixotropic epoxy that is used for potting, damming, staking, and bonding circuit board components, metals, and plastics. It offers low shrinkage, good dielectric properties and environmental protection. 1 gal Pail.
| Typical Use: | Used as a small mass potting compounds, staking or damming adhesives, or polymer systems where the application requires low shrinkage and excellent adhesion to a wide variety of plastics, metals and circuit board materials. |
| Chemical Composition: | Epoxy resin |
| Color: | Black |
| Components: | 1 part |
| Cure System: | Heat |
| Cure Time: | 5 to 10min @ 150 °C |
| Dielectric Strength: | 440 V/mil |
| Elongation: | <1% @ break |
| Flash Point: | >93.3 °C |
| Hardness: | 85 D |
| Service Temperature: | -40 to 150 °C |
| Shear Strength: | 1,500 |
| Specific Gravity: | 1.3 |
| Tensile Strength: | 4,800 psi |
| Thermal Conductivity: | 0.36 W/mK |
| Viscosity: | 500,000 |
| Volume Resistivity: | 8 x 10^14 ohm-cm |
