ResinLab EP1290 Epoxy Adhesive Part B Clear 5 gal Pail

Part number: EP1290 CLEAR - B PL Manufacturer SKU: EP1290 CLEAR B PL
ResinLab EP1290 Epoxy Adhesive Part B Clear 5 gal Pail
Quantity Price
1 $1,809.26 1809.260000000 USD New Limited Availability EP1290 CLEAR - B PL
2 $1,393.13 1393.130000000 USD New Limited Availability EP1290 CLEAR - B PL
3+ $1,293.62 1293.620000000 USD New Limited Availability EP1290 CLEAR - B PL
Usually Ships in 2-3 Business Days. Non-returnable product. Canceled orders may incur a fee at the supplier’s discretion.

ResinLab EP1290 Clear is a two component, room temperature and heat curing, unfilled epoxy that is used for bonding plastics and metals. It is semi-flexible, free flowing, has good air release and self leveling. It is resistant to salt solutions, water, impact, vibrations, organic and inorganic solvents. Part B, 5 gal Pail.

<p>ResinLab EP1290 Clear is a two component, room temperature and heat curing, unfilled epoxy that is used for bonding plastics and metals. It is semi-flexible, free flowing, has good air release and self leveling. It is resistant to salt solutions, water, impact, vibrations, organic and inorganic solvents. Part B, 5 gal Pail.</p>
Typical Use: Designed for bonding metals and plastics.
Chemical Composition: Epoxy
Color: Clear
Components: 2 part
Cure System: Room Temperature/Heat
Cure Time: 16 to 24h @ room temperature; 2h @ 65 °C; 20min @ 100 °C
Dielectric Strength: 850 V/mil
Elongation: 40% to 50% @ break
Flash Point: >93 °C
Hardness: 60 D
Mix Ratio: 1:1 by volume; 1.22:1 by weight
Service Temperature: -40 to 150 °C
Shear Strength: 2,500
Specific Gravity: Part B: 0.99; Mixed: 1.08
Tensile Strength: 1,600 psi
Thermal Conductivity: 0.14 W/mK
Viscosity: Part B: 7,500; Mixed: 30,000
Volume Resistivity: 5 x 10^12 ohm-cm
Working Time: >2h

 

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