ResinLab EP1290 Clear is a two component, room temperature and heat curing, unfilled epoxy that is used for bonding plastics and metals. It is semi-flexible, free flowing, has good air release and self leveling. It is resistant to salt solutions, water, impact, vibrations, organic and inorganic solvents. Part A, 5 gal Pail.
Typical Use: | Designed for bonding metals and plastics. |
Chemical Composition: | Epoxy |
Color: | Clear |
Components: | 2 part |
Cure System: | Room Temperature/Heat |
Cure Time: | 16 to 24h @ room temperature; 2h @ 65 °C; 20min @ 100 °C |
Dielectric Strength: | 850 V/mil |
Elongation: | 40% to 50% @ break |
Flash Point: | >249 °C |
Hardness: | 60 D |
Mix Ratio: | 1:1 by volume; 1.22:1 by weight |
Service Temperature: | -40 to 150 °C |
Shear Strength: | 2,500 |
Specific Gravity: | Part A: 1.16; Mixed: 1.08 |
Tensile Strength: | 1,600 psi |
Thermal Conductivity: | 0.14 W/mK |
Viscosity: | Part A: 50,000; Mixed: 30,000 |
Volume Resistivity: | 5 x 10^12 ohm-cm |
Working Time: | >2h |