ResinLab EP1026T2 Clear is a two component, room and elevated temperature curing, unfilled, epoxy adhesive paste that is used for rapid bonding of plastics, metal, and ceramics. It is semi-rigid, non-sagging, and resistant to salt spray, water, organic and inorganic solvents. 1:1 mix ratio. 50 mL Cartridge.
Typical Use: | It was especially formulated to a 1:1 mix ratio for use in either MMD equipment or side-by-side dual cartridges for easy dispensing. |
Chemical Composition: | Epoxy |
Color: | Clear |
Components: | 2 part |
Cure System: | Room Temperature |
Cure Time: | 24h |
Dielectric Strength: | 410 V/mil |
Elongation: | 3 to 5% |
Flash Point: | >93.3 °C |
Hardness: | 80 D |
Mix Ratio: | 1:1 by volume |
Service Temperature: | -40 to 130 °C |
Specific Gravity: | Mixed: 1.16 |
Tack Free Time: | 20 to 30min |
Tensile Strength: | 7,000 psi |
Viscosity: | Mixed: Paste |
Volume Resistivity: | 8 x 10^14 ohm-cm |
Working Time: | 3 to 5min |