Permabond ET500 is a two component, fast curing epoxy adhesive that is used to bond a variety of substrates such as metal, plastics, wood, composites, and ceramics. It is a general purpose adhesive that is recommended for small component assembly and will fully cure at room temperature. 1:1 mix ratio by volume, 50 mL Kit.
Typical Use: | Used to bond a variety of substrates such as wood, metal, ceramics and some plastics and composites. It is typically used for small component assembly and is suitable for applications that require a clear bond line. |
Chemical Composition: | Part A: Epoxy resin; Part B: Amine hardener |
Color: | Clear |
Components: | 2 part |
Cure System: | Room Temperature |
Cure Time: | Full strength 24h |
Elongation: | 3.7% |
Flash Point: | Part A: >93.3 °C; Part B: 148.8 °C |
Gap Filling: | 2 mm |
Hardness: | 73 D |
Mix Ratio: | 1:1 by volume |
Shear Strength: | 1,700 to 2,000 |
Specific Gravity: | Part A: 1.17; Part B: 0.98 |
Viscosity: | Part A: 12,000; Part B: 22,500 |
Working Time: | 3 to 4min |