ITW Performance Polymers Devcon Epoxy Plus 25 14278 is a two component, structural adhesive that is used for bonding structural parts, thermoset plastics, and metals. It offers flexibility, high dielectric strength, non-shrinking, and resistance to peeling, impact, and fatigue. 50 mL Cartridge.
Typical Use: | Bonds metals, thermoset plastics and structural parts. |
Color: | Resin: Gray; Hardener: White |
Components: | 2 part |
Cure System: | Room Temperature |
Cure Time: | 30h |
Dielectric Strength: | 550 V/mil |
Elongation: | 20% |
Flash Point: | Resin: >204.4 °C; Hardener: >110 °C |
Hardness: | 74 D |
Impact Resistance: | 10 ft-lb/in^2 |
Mix Ratio: | 1:1 by volume; 57:43 by weight |
Peel Strength: | 20 to 25 pli |
Service Temperature: | -40 to 93.3 °C |
Shear Strength: | 2,750 |
Specific Gravity: | Resin: 1.39; Hardener: 1 |
Viscosity: | Mixed: 70,000 |
Working Time: | 25min @ 22 °C |