Henkel Loctite Ablestik 45 Clear, formerly Emerson and Cuming ECCOBOND, is a two component, heat curing, unfilled, epoxy adhesive system that is used for general purpose, assembly applications. It offers controlled flexibility, non-conductive properties, and is easy to use. 8 lb Pail.
Typical Use: | Used as a general purpose adhesive and is particularly useful when bonding dissimilar substrates such as metal to plastic. |
Brand: | Ablestik |
Chemical Composition: | Epoxy |
Color: | Clear |
Components: | 2 part |
Cure System: | Room Temperature/Heat |
Cure Time: | 16 to 24h @ 25 °C; 4 to 6h @ 45 °C; 2 to 4h @ 65 °C; 15 to 30min @ 105 °C |
Dielectric Strength: | 14 kV/mm |
Flash Point: | >200 °C |
Hardness: | Rigid: 80 D; Semi-rigid: 60 to 70 D, Flexible: 60 D |
Mix Ratio: | Rigid: 100:50 by weight; Semi-rigid: 100:100 by weight; Flexible: 100:150 by weight |
Service Temperature: | Rigid: -40 to 90 °C; Semi-rigid: -55 to 80 °C; Flexible: -55 to 65 °C |
Shear Strength: | Rigid: 2,500 @ 25 °C; Semi-rigid: 1,900 @ 25 °C; Flexible: 600 @ 25 °C |
Specific Gravity: | Rigid: 1.34; Semi-rigid: 1.24; Flexible: 1.18 |
Thermal Conductivity: | 0.35 W/mK |
Viscosity: | Rigid: 37,000; Semi-rigid: 37,000; Flexible: 36,000 |
Volume Resistivity: | Rigid: 1 x 10^13 ohm-cm; Semi-rigid: 1 x 10^13 ohm-cm; Flexible: 1 x 10^10 ohm-cm |
Working Time: | Rigid: 120min @ 25 °C; Semi-rigid: 140min @ 25 °C; Flexible: 160min @ 25 °C |