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Dow Optical Encapsulants

 

The global LED lighting market has expanded rapidly over the last decade, with businesses and consumers making the switch to a more energy-efficient illumination option. LEDs are reliable and robust, offering lower power consumption, high brightness, and a wide range of shape and size options. Some LED lighting applications are exposed to harsh environmental conditions like moisture, heat, and damaging contaminants. These types of components have special requirements for high ingress protection, which call for specific adhesive properties.

 

LED Strips

FLEXIBLE & RIGID LED STRIPS

Outdoor LED Displays

OUTDOOR LED DISPLAYS

Spot, Flood & General Area

SPOT, FLOOD & GENERAL AREA

Small Portable-Type

SMALL PORTABLE-TYPE

 

 

EXISTING ENCAPSULATION MATERIALS

While adhesive solutions like conformal coatings and molded lenses are available, optical encapsulants provide the highest degree of protection and easy of use in harsh environments. This technology is particularly suited for explosion proof or high IP rated luminaires. Manufacturers can choose from epoxy, urethane, and silicone formulations based on their unique application needs.

 

Material Advantages Limitations
Epoxy
  • Hard - best mechanical protection
  • Good adhesion
  • Lowest price
  • Weak photo resistance
  • Shrinkage during cure
  • Health concern
Urethane
  • Tunable hardness - soft to hard
  • Conditional adhesion to substrate
  • Medium price
  • Shrinkage during cure > stress
  • Sensitive to moisture during cure > bubbles
  • Health concern: isocyanates
Silicone
  • Highest thermal stability & photo resistance
  • Good moisture & humidity resistance
  • No exotherm & no shrinkage
  • No adhesion, need of primer
  • Higher price
  • Cure inhibition

 

 

 

Dow Dowsil™ EI-2888 Primerless Silicone Encapsulant

 

Discover the benefits of DOWSIL™ EI-2888 Primerless Silicone Encapsulant, an optically clear silicone that provides protection for LEDs from moisture and surface contaminants. This product’s optimum rheological properties allow for light fixtures in a variety of shapes or forms whilst delivering superior optical performance.

 

Suitable for encapsulating rigid and flexible circuit boards for indoor and outdoor LED Lighting, explosion proof and high ingress protection rated luminaire as well as outdoor displays applications and for space grade applications.

 

Features

  • Primerless adhesion with inhibition resistance at low viscosity
  • Room temperature curing with optional heat acceleration
  • A cost effective alternative (does not contain platinum like other encapsulants)

Applications

  • Outdoor displays
  • Explosion proof lighting
  • Flexible and rigid LED strips

 

 

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